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We found these Patents Results for: Aluminum Solder
  Engineering Patents: 1 - 20 of 300 Next 20 results >    
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Aluminum-based solder material
A solder material that is especially suitable for the fluxless hard soldering of aluminum-based components consists of an aluminum-based alloy that View Patent Detail from MicroPatent
Direct solder bumping of hard to solder substrate
Direct solder bumping of hard to solder substrate View Patent Detail from MicroPatent
Tin-and zinc-based solder fillers for aluminum body parts and...
Tin-and zinc-based solder fillers for aluminum body parts and methods of applying the same View Patent Detail from MicroPatent
Tin- and zinc-based solder fillers for aluminum body parts and...
Tin- and zinc-based solder fillers for aluminum body parts and methods of applying the same View Patent Detail from MicroPatent
Solder composition
A solder composition containing a small amount of aluminum added to the solder metal, to avoid cracking of solder joints in electronic circuits, View Patent Detail from MicroPatent
Tin-zinc lead-free solder and solder-joined part
Tin-zinc lead-free solder and solder-joined part View Patent Detail from MicroPatent
TIN-ZINC LEAD-FREE SOLDER AND SOLDER-JOINED PART
TIN-ZINC LEAD-FREE SOLDER AND SOLDER-JOINED PART View Patent Detail from MicroPatent
Tape withh solder forms and methods for transferring solder...
Tape withh solder forms and methods for transferring solder forms to chip assemblies View Patent Detail from MicroPatent
Solder clad substrate
The solder particles (120) have a predetermined melting temperature and are made from one or more of the following elements: tin, lead, bismuth, View Patent Detail from MicroPatent
Method for depositing solder onto aluminum metal material
Method for depositing solder onto aluminum metal material A method for depositing solder onto aluminum metal material comprises steps of: View Patent Detail from MicroPatent
Multiple alloy solder preform
The solder particles comprise one or more of the following elements: tin, lead, bismuth, indium, copper, antimony, cadmium, arsenic, aluminum, View Patent Detail from MicroPatent
Filled solder
CTE material, such as graphite, carbon fiber, diamond, boron nitride, aluminum nitride, silicon carbide, silicon nitride, zinc oxide, alumina, View Patent Detail from MicroPatent
Nickel-base solder for high-temperature solder joints
Nickel-base solder for high-temperature solder joints View Patent Detail from MicroPatent
Body solder of powdered aluminum and a polyester
Body solder of powdered aluminum and a polyester View Patent Detail from MicroPatent
FLUXING AGENT PREPARATION AND METHOD FOR EFFECTING A...
FLUXING AGENT PREPARATION AND METHOD FOR EFFECTING A SOLDER-FREE JOINING OF ALUMINUM OR ALUMINUM ALLOYS View Patent Detail from MicroPatent
Constructions comprising solder bumps
A mass is formed over the aluminum- containing material, with the mass predominantly comprising a metal other than aluminum. View Patent Detail from MicroPatent
Method for separating a flat pipe section of aluminum or...
Method for separating a flat pipe section of aluminum or aluminum alloy from a solder-coated thin-walled flat pipe section member View Patent Detail from MicroPatent
Constructions comprising solder bumps
A mass is formed over the aluminum- containing material, with the mass predominantly comprising a metal other than aluminum. View Patent Detail from MicroPatent
Antifreeze concentrate containing inhibitors to prevent...
Antifreeze concentrate containing inhibitors to prevent localized corrosion of aluminum and solder alloy View Patent Detail from MicroPatent
SOLDER FILLERS FOR ALUMINUM BODY PARTS AND METHODS OF APPLYING...
SOLDER FILLERS FOR ALUMINUM BODY PARTS AND METHODS OF APPLYING THE SAME View Patent Detail from MicroPatent
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