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We found these Patents Results for:
Die Attach Coating
Engineering Patents: 1 - 13 of 13
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®
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Patents
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Vacuum
die
attach
for integrated circuits
Vacuum
die
attach
for integrated circuits
View Patent Detail from MicroPatent
Method of packing an IC
die
in a molded plastic employing an...
Method of packing an IC
die
in a molded plastic employing an ultra-thin
die
coating
process
View Patent Detail from MicroPatent
Wafer back side
coating
to balance stress from passivation...
Wafer back side
coating
to balance stress from passivation layer on front of wafer and be used as a
die
attach
adhesive
View Patent Detail from MicroPatent
Wafer back side
coating
to balance stress from passivation...
Wafer back side
coating
to balance stress from passivation layer on front of wafer and be used as a
die
attach
adhesive
View Patent Detail from MicroPatent
Apparatus and method for
die
attachment
Apparatus and method for
die
attachment
View Patent Detail from MicroPatent
Heatsink and package structure for wirebond chip rework and...
View Patent Detail from MicroPatent
Heatsink and package structure for wirebond chip rework and...
View Patent Detail from MicroPatent
A PACKAGED SEMICONDUCTOR WITH COATED LEADS AND METHOD...
The
coating
(430) is compatible with solder techniques that are commonly used to
attach
packaged semiconductors to a printed circuit board.
View Patent Detail from MicroPatent
Packaged semiconductor with coated leads and method therefore
The
coating
is compatible with solder techniques that are commonly used to
attach
packaged semiconductors to a printed circuit board.
View Patent Detail from MicroPatent
METHOD OF ATTACHING INTEGRATED CIRCUIT DIES BY ROLLING...
One of the dies (182) is attached to a
die
attach
pad (188) by placing the die's adhesive layer (184) in contact with the pad (188) which is then
View Patent Detail from MicroPatent
Pressure sensitive pricing tag/label
A versatile paperboard panel can be used to
attach
identifying (e.g. price) information to a wide variety of articles.
View Patent Detail from MicroPatent
Method and apparatus for reducing resin bleed during the...
lead frame paddle comprises a
coating
thereon to reduce or eliminate the flow of
die
attach
adhesive from under the
die
and over bond sites or
View Patent Detail from MicroPatent
LEADFRAME FOR MOLDED PLASTIC ELECTRONIC PACKAGES
View Patent Detail from MicroPatent
