Heat Sink Compound Patents Results

We found these Patents Results for: Heat Sink Compound

Engineering Patents: 1 - 20 of 140

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Method of establishing a thermal joint on a heat sink Upon depressing a tip of the compound against the heat sink a resulting vacuum therebetween cooperates with the ambient air pressure to preclude View Patent Detail from MicroPatent
Heat sink and mounting arrangement therefor along the outer surface of the heat sink provide reservoirs for a potting compound to further fix the heat sink and improve the thermal conductivity View Patent Detail from MicroPatent
Heat-absorbing heat sink View Patent Detail from MicroPatent
Printed circuit board and heat sink arrangement Printed circuit board and heat sink arrangement View Patent Detail from MicroPatent
PRINTED CIRCUIT BOARD AND HEAT SINK ARRANGEMENT PRINTED CIRCUIT BOARD AND HEAT SINK ARRANGEMENT View Patent Detail from MicroPatent
Semiconductor package structure having universal lead frame... package structure having universal lead frame and heat sink comprises a chip, a lead frame, a heat sink, a bonding wire, and a molding compound. View Patent Detail from MicroPatent
Semiconductor package structure having universal lead frame... package structure having universal lead frame and heat sink comprises a chip, a lead frame, a heat sink, a bonding wire, and a molding compound. View Patent Detail from MicroPatent
Semiconductor device having semiconductor element housed in... Semiconductor device having semiconductor element housed in packed with heat sink View Patent Detail from MicroPatent
Method of manufacturing a porous metal heat sink Method of manufacturing a porous metal heat sink View Patent Detail from MicroPatent
Semiconductor die with attached heat sink and transfer mold Semiconductor die with attached heat sink and transfer mold View Patent Detail from MicroPatent
Semiconductor die with attached heat sink and transfer mold Semiconductor die with attached heat sink and transfer mold View Patent Detail from MicroPatent
Semiconductor die with attached heat sink and transfer mold Semiconductor die with attached heat sink and transfer mold View Patent Detail from MicroPatent
Semiconductor die with attached heat sink and transfer mold Semiconductor die with attached heat sink and transfer mold View Patent Detail from MicroPatent
Transfer molding encapsulation of a semiconductor die with... Transfer molding encapsulation of a semiconductor die with attached heat sink View Patent Detail from MicroPatent
Encapsulated transfer molding of a semiconductor die with... Encapsulated transfer molding of a semiconductor die with attached heat sink View Patent Detail from MicroPatent
Encapsulated transfer molding of a semiconductor die with... Encapsulated transfer molding of a semiconductor die with attached heat sink View Patent Detail from MicroPatent
HEAT SINK HAVING A HIGH THERMAL CONDUCTIVITY HEAT SINK HAVING A HIGH THERMAL CONDUCTIVITY The invention relates to a heat sink comprised of a diamond-containing composite material. View Patent Detail from MicroPatent
Method for fabricating a heat sink-integrated semiconductor... A heat sink-integrated semiconductor package is fabricated by a characteristic method comprising the steps of dispensing a liquid epoxy resin over at View Patent Detail from MicroPatent
Methods for transfer molding encapsulation of a semiconductor... Methods for transfer molding encapsulation of a semiconductor die with attached heat sink View Patent Detail from MicroPatent
Method for transfer molding encapsulation of a semiconductor... Method for transfer molding encapsulation of a semiconductor die with attached heat sink View Patent Detail from MicroPatent

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