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We found these Patents Results for: Pcm Electronic Material
  Engineering Patents: 1 - 2 of 2  
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Heat pipe having a wick structure containing phase change materials
... use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles ... View Patent Detail from MicroPatent
Heat pipe having a wick structure containing phase change materials
... use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles ... View Patent Detail from MicroPatent
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PTG Industries: Electronics & Semiconductor Manufacturing
Develops high-tech laser technology and systems for precision applications for FPD, semiconductor, part marking, and industrial manufacturing use.
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